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IEEE Transactions on Semiconductor Manufacturing 2026State Key Laboratory of TribologTsinghuaSpatio-temporal forecasting

Novel Structure of a Deep Neural Network-Based Material Removal Rate Prediction Model for Multizone Chemical Mechanical Planarization Process Control

A two-part deep neural network predicts multizone CMP material removal rates by modeling polishing time and pressure distribution interactions from industrial data.

Bangxu Liu, Dewen Zhao, Xinchun Lu, Yuhong Liu

Published Mar 13, 2026 · 1 citation

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